New Safety-Rated Inductive Sensors for Safety over IO-Link from Balluff

Reliably detect metal - rugged and wear-free

FLORENCE, Ky. (PRWEB) March 23, 2018

Balluff is excited to announce the release of a complete family of inductive safety sensors. These devices can be easily and inexpensively connected directly to the Balluff "Safety Over IO-Link" module, allowing integrators to implement a complete safety + automation sensing and network solution.

These sensors detect the approach of metallic targets without direct contact, and do not require a special mating actuator. This means that safety signals for position and end-of-travel can be generated, or metallic workpiece carriers can be sensed directly. The sensors are also suitable as pulse transmitters for counting tasks and speed sensing. They are available in industry standard form factors including M12, M18, M30 and Q40. The product family includes both PLd/SIL CL 2 and PLe/SIL CL 3 devices, giving customers the flexibility to meet the price/safety performance needs of their application. The M12 plug connector means that the inductive safety sensors can be connected to any desired safety processor, including safety relays, programmable logic modules or safety controllers. And connection to the Balluff "Safety Over IO-Link" module is "plug & play."

Learn more at http://www.balluff.com.

About Balluff Inc.: Balluff Inc. is the U.S. subsidiary of Balluff GmbH, Neuhausen, Germany. Balluff is a leading supplier of networked IO-Link control system architectures that unlock the potential of the IIoT and Industry 4.0. Balluff offers a wide range of intelligent IO-Link and industrial Ethernet sensors in a variety of technologies including inductive, photoelectric, capacitive, and magnetic as well as magnetostrictive linear position sensors, magnetic tape linear encoders, industrial RFID systems, and industrial vision systems. Balluff provides cost-saving, process-enhancing solutions to machine builders and manufacturers to control, regulate, automate, assemble, position, and monitor manufacturing, assembly, and packaging sequences. Industries served include: automotive, packaging, food processing, beverages, tire, primary metals, conventional and alternative energy, semiconductor, plastics, and fluid power.

For the original version on PRWeb visit: http://www.prweb.com/releases/2018/03/prweb15358539.htm